Combination vacuum and over-pressure process chamber and methods related thereto
US11367640B2 · kind B2 · utility
0Cited by
9References
7Claims
0Family size
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Key dates
| Filing date | Oct 24, 2019 |
| Grant date | Jun 21, 2022 |
| Priority date | — |
| Expiry date | Oct 24, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27D2007/063
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process chamber system adapted for both vacuum process steps and steps at pressures higher than atmospheric pressure. The chamber door may utilize a double door seal which allows for high vacuum in the gap between the seals such that the sealing force provided by the high vacuum in the seal gap is higher than the opposing forces due to the pressure inside the chamber and the weight of the components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.