Radiation-emitting semiconductor chip with overlapping contact layers

US11367808B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Fabian Kopp · Bukit Mertajam, MY
• Franz Eberhard · Kilchberg, CH
• Björn Muermann · Regensburg, DE
• Attila Molnar · Vadnais Heights, US

Key dates

• Filing date: Dec 11, 2018
• Grant date: Jun 21, 2022
• Expiry date: Dec 12, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/819

Abstract

A radiation-emitting semiconductor chip includes a semiconductor body; a first contact layer having a first contact surface for external electrical contacting of the semiconductor chip and a first contact web structure connected to the first contact surface, wherein the first contact web structure is a region of the first contact layer that, compared to the first contact surface, has a comparatively small extent at least in a lateral direction; a second contact layer, wherein first and second contact web structures overlap in places in plan view of the semiconductor chip; a current distribution layer; and an insulation layer having a plurality of openings into which the current distribution layer extends.