Patent · US Active

Slip-plane MEMs probe for high-density and fine pitch interconnects

US11372023B2 · kind B2 · utility

1Cited by
24References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 11, 2021
Grant dateJun 28, 2022
Priority date—
Expiry dateFeb 11, 2041

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2224/29339
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A device probe includes a primary probe arm and a subsequent probe arm with a slip plane spacing between the primary probe arm and subsequent probe arm. Each probe arm is integrally part of a probe base that is attachable to a probe card. During probe use on a semiconductive device or a semiconductor device package substrate, overtravel of the probe tip allows the primary and subsequent probe arms to deflect, while sufficient resistance to deflection creates a useful contact with an electrical structure such as an electrical bump or a bond pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.