Inventor · Tigard, OR, US

Joe Walczyk

29Patents
2h-index
42Co-inventors
49Inventor score

Filing activity: Sep 28, 2012 → Feb 11, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US9046569B2 Seal method for direct liquid cooling of probes used at first level interconnect Emerging Cross-Sectional Technologies 8 Active
US9523713B2 Interconnects including liquid metal Emerging Cross-Sectional Technologies 2 Active
US10935573B2 Slip-plane MEMS probe for high-density and fine pitch interconnects Electricity 2 Active
US11372023B2 Slip-plane MEMs probe for high-density and fine pitch interconnects Electricity 1 Active
US9128121B2 Mechanism for facilitating a dynamic electro-mechanical interconnect having a cavity for embedding electrical components and isolating electrical paths Emerging Cross-Sectional Technologies 1 Active
US9674943B2 Actuation mechanisms for electrical interconnections Electricity 1 Active
US10644458B2 Shielded interconnect array Emerging Cross-Sectional Technologies 1 Active
US11249113B2 High density and fine pitch interconnect structures in an electric test apparatus Electricity 0 Active
US10877068B2 High density and fine pitch interconnect structures in an electric test apparatus Electricity 0 Active
US11935860B2 Electrical connector with insulated conductive layer Electricity 0 Active
US12061230B2 Active optical plug to optically or electrically test a photonics package Physics 0 Active
US11592472B2 Thermal switch for rapid thermal coupling and decoupling of devices under test Physics 0 Active
US12341281B2 Micro socket electrical couplings for dies Electricity 0 Active
US12087658B2 Hybrid thermal interface material (TIM) with reduced 3D thermal resistance Electricity 0 Active
US11398414B2 Sloped metal features for cooling hotspots in stacked-die packages Electricity 0 Active
US12009612B2 Dual-sided socket device with corrugation structures and shield structures Electricity 0 Active
US10324112B2 Package testing system and method with contact alignment Physics 0 Active
US11581237B2 Cooling apparatuses for microelectronic assemblies Electricity 0 Active
US12080620B2 Additively manufactured structures for heat dissipation from integrated circuit devices Performing Operations; Transporting 0 Active
US9581639B2 Organic space transformer attachment and assembly Emerging Cross-Sectional Technologies 0 Active
US10488438B2 High density and fine pitch interconnect structures in an electric test apparatus Electricity 0 Active
US11656247B2 Micro-coaxial wire interconnect architecture Physics 0 Active
US11639556B2 Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays Electricity 0 Active
US12135460B2 Stackable photonics die with direct optical interconnect Electricity 0 Active
US10338099B2 Low profile edge clamp socket Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.