Embedded thin-film magnetic inductor design for integrated voltage regulator (IVR) applications
US11373966B2 · kind B2 · utility
1Cited by
2References
19Claims
0Family size
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Key dates
| Filing date | Sep 2, 2020 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Sep 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package including a package substrate; an interposer electrically coupled to the package substrate and including a metal layer; a die including an integrated voltage regulator and electrically coupled to the interposer by solder features; and an inductor formed by a magnetic material disposed between two of the solder features electrically coupled to each other by a portion of the metal layer of the interposer, the inductor electrically coupled to the integrated voltage regulator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.