Guotao Wang
9Patents
2h-index
15Co-inventors
44Inventor score
Filing activity: Dec 29, 2006 → Apr 8, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10700051B2 | Multi-chip packaging | Electricity | 3 | Active |
| US10256198B2 | Warpage control for microelectronics packages | Electricity | 2 | Active |
| US7659192B2 | Methods of forming stepped bumps and structures formed thereby | Electricity | 1 | Active |
| US9594617B2 | Method and apparatus for positioning crash | Physics | 1 | Active |
| US11373966B2 | Embedded thin-film magnetic inductor design for integrated voltage regulator (IVR) applications | Electricity | 1 | Active |
| US11114388B2 | Warpage control for microelectronics packages | Electricity | 0 | Active |
| US11348911B2 | Multi-chip packaging | Electricity | 0 | Active |
| US12199085B2 | Multi-chip packaging | Electricity | 0 | Active |
| US11817444B2 | Multi-chip packaging | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.