Electronic component mounting device
US11373975B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 28, 2017 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Jun 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component mounting device (100) bonds a semiconductor die (150) to a substrate by thermocompression bonding, and seals, using an insulating resin, a gap between the semiconductor die (150) and the substrate. The electronic component mounting device is provided with: a film cutting mechanism (200) for cutting a long film (210) into cut pieces; and a mounting tool (110), which vacuum-sucks the semiconductor die (150), and bonds the die to the substrate by thermocompression bonding. Consequently, in the electronic component mounting device (100) that moves a mounting head in the horizontal direction, adhesion of the insulating resin to the mounting tool can be suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.