Resin composition, laminate sheet, and multilayer printed wiring board
US11377546B2 · kind B2 · utility
1Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2017 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Dec 7, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0129
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a resin composition comprising an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.