Patent · US Active

Device and method for processing a multiplicity of semiconductor chips

US11378590B2 · kind B2 · utility

0Cited by

1References

15Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Michael Bergler · Etzenricht, DE
Roland Zeisel · Tegernheim, DE

Key dates

Filing date	Oct 1, 2019
Grant date	Jul 5, 2022
Priority date	—
Expiry date	Oct 1, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/2635
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A device for processing a multiplicity of semiconductor chips in a wafer assemblage includes an electrically conductive carrier for contacting rear contacts of the semiconductor chips, an electrically conductive film for contacting front contacts of the semiconductor chips that are situated opposite the rear contacts, and a squeegee, which is displaceable relative to the film and is configured to press a region of the film in the direction toward the carrier.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.