Apparatus and method for gas delivery in semiconductor process chambers
US11380557B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2017 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Apr 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/367
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments of an apparatus for gas delivery in a semiconductor processing system use a gas distribution plate that has a plurality of gas passageways where the passageways have surfaces with an average roughness of less than or equal to approximately 10 Ra. In some embodiments, the gas distribution plate has one or more internal fluid passageways that are capable of being fluidly coupled to one or more fluid sources to provide temperature control of the gas distribution plate. In some embodiments, the gas distribution plate has at least one internal cavity with at least one heatsink that may surround at least one of the plurality of gas passageways to provide, at least partial, temperature control of the gas distribution plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.