Cutting method
US11380586B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 18, 2018 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Dec 6, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/53
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, forming a groove in the workpiece along an intended cut line. In the forming a groove, a first dry etching process is performed from a front surface toward a rear surface of the workpiece. After the first dry etching process, a first pressure-reducing process is performed in which the workpiece is placed under an atmosphere of reduced pressure as compared to pressure during the first dry etching process. After the first pressure-reducing process, a second dry etching process is performed from the front surface toward the rear surface of the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.