Method for making a heat dissipation structure
US11380603B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 8, 2019 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Mar 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.