Microelectronic assemblies having conductive structures with different thicknesses on a core substrate
US11380609B2 · kind B2 · utility
0Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2018 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Nov 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20641
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.