Liwei Cheng
8Patents
1h-index
25Co-inventors
43Inventor score
Filing activity: Mar 30, 2017 → May 12, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10741947B2 | Plated through hole socketing coupled to a solder ball to engage with a pin | Electricity | 1 | Active |
| US11380609B2 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Electricity | 0 | Active |
| US11705389B2 | Vias for package substrates | Electricity | 0 | Active |
| US11393762B2 | Formation of tall metal pillars using multiple photoresist layers | Electricity | 0 | Active |
| US11769719B2 | Dual trace thickness for single layer routing | Electricity | 0 | Active |
| US11849790B2 | Apparel fitting simulation based upon a captured two-dimensional human body posture image | Physics | 0 | Active |
| US12288744B2 | Microelectronic assemblies having conductive structures with different thicknesses on a core substrate | Electricity | 0 | Active |
| US11120037B2 | Test data integration system and method thereof | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.