Chip-on-wafer structure with chiplet interposer
US11380611B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2020 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Jul 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of forming a semiconductor structure includes bonding a first die and a second die to a first side of a first interposer and to a first side of a second interposer, respectively, where the first interposer is laterally adjacent to the second interposer; encapsulating the first interposer and the second interposer with a first molding material; forming a first recess in a second side of the first interposer opposing the first side of the first interposer; forming a second recess in a second side of the second interposer opposing the first side of the second interposer; and filling the first recess and the second recess with a first dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.