Inventor · Taipei, TW

Weiming Chris Chen

40Patents
6h-index
41Co-inventors
65Inventor score

Filing activity: Dec 19, 2008 → May 24, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US10319699B2 Chip package having die structures of different heights Electricity 17 Active
US9746097B1 Solenoid of electromagnetic valve Electricity 8 Active
US10304800B2 Packaging with substrates connected by conductive bumps Electricity 8 Active
US8302260B2 Hinge assembly Physics 8 Active
US7971321B2 Hinge and an electronic device with the hinge Fixed Constructions 7 Active
US7954203B2 Hinge and an electronic device with the hinge Fixed Constructions 7 Active
US7752711B1 Hinge and an electronic device with the hinge Physics 5 Active
US10510722B2 Semiconductor device and method for manufacturing the same Electricity 4 Active
US11484122B2 Sofa armrest connection structure and sofa assembly Human Necessities 4 Active
US11462418B2 Integrated circuit package and method Electricity 3 Active
US11164855B2 Package structure with a heat dissipating element and method of manufacturing the same Electricity 2 Active
US11069467B2 Solenoid device Electricity 2 Active
US7996959B2 Hinge and an electronic device with the hinge Physics 2 Active
US8011065B2 Hinge and an electronic device with the hinge Physics 2 Active
US11139282B2 Semiconductor package structure and method for manufacturing the same Electricity 2 Active
US11380611B2 Chip-on-wafer structure with chiplet interposer Electricity 2 Active
US8305747B2 Rotary hinge and a portable electronic device with the same Electricity 1 Active
US11406191B2 Iron sofa frame structure, sofa and production method thereof Human Necessities 1 Active
US10515869B1 Semiconductor package structure having a multi-thermal interface material structure Electricity 1 Active
US10801605B2 Pressure control device Mechanical Engineering; Lighting; Heating 1 Active
US11508696B2 Semiconductor device Electricity 1 Active
US12315786B2 Semiconductor structure and manufacturing method thereof Electricity 0 Active
US12108069B1 Method, apparatus, system, and electronic device for transmitting composite photo data Electricity 0 Active
US12062590B2 Method for manufacturing semiconductor package structure Electricity 0 Active
US11444038B2 Forming large chips through stitching Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.