Patent · US Active

Fan out package-on-package with adhesive die attach

US11380616B2 · kind B2 · utility

0Cited by

15References

20Claims

0Family size

Assignee

Intel IP Corporation · US

Inventors

David O'Sullivan · Ottobrunn, DE
Bernd Waidhas · Nittendorf, DE
Thomas J. Huber · Naperville, US

Key dates

Filing date	May 16, 2018
Grant date	Jul 5, 2022
Priority date	—
Expiry date	Nov 3, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Fan Out Package-On-Package (PoP) assemblies in which a second chip is adhered to a non-active side of a first chip. An active side of the first chip embedded in a first package material may be electrically coupled through one or more redistribution layers that fan out to package interconnects on a first side of the POP. A second chip may be adhered, with a second package material, to the non-active side of the first chip. An active side of the second chip may be electrically coupled to the package interconnects through a via structure extending through the first package material. Second interconnects between the second chip, or a package thereof, may contact the via structure. Use of the second package material as an adhesive may improve positional stability of the second chip to facilitate wafer-level assembly techniques.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.