David O'Sullivan
7Patents
3h-index
12Co-inventors
50Inventor score
Filing activity: Aug 25, 2011 → Jun 30, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9646856B2 | Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chip | Electricity | 229 | Active |
| US9064883B2 | Chip with encapsulated sides and exposed surface | Electricity | 123 | Active |
| US8786105B1 | Semiconductor device with chip having low-k-layers | Electricity | 3 | Active |
| US9111947B2 | Chip arrangement with a recessed chip housing region and a method for manufacturing the same | Electricity | 2 | Active |
| US11735570B2 | Fan out packaging pop mechanical attach method | Electricity | 1 | Active |
| US11380616B2 | Fan out package-on-package with adhesive die attach | Electricity | 0 | Active |
| US12243856B2 | Fan out packaging pop mechanical attach method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.