Package structure and method for fabricating the same
US11380626B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2020 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Oct 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B61/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a package structure, including a mounting pad having a mounting surface, a semiconductor chip disposed on the mounting surface of the mounting pad, wherein the semiconductor chip includes: a first surface perpendicular to a thickness direction of the semiconductor chip, a second surface opposite to the first surface and facing the mounting surface, and a third surface connecting the first surface and the second surface, a magnetic device disposed in the semiconductor chip, a first magnetic field shielding at least partially surrounding the third surface, a second magnetic field shielding, including a top surface facing the second surface of the semiconductor chip, and a molding surrounding the semiconductor chip, wherein the entire top surface of the second magnetic field shielding is in direct contact with the molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.