Electronic device comprising optical electronic components and manufacturing method
US11380663B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2020 |
| Grant date | Jul 5, 2022 |
| Priority date | — |
| Expiry date | Sep 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An opaque dielectric carrier and confinement substrate is formed by a stack of layers laminated on each other. The stack includes a solid back layer and a front frame having a peripheral wall and an intermediate partition which delimits two cavities located on top of the solid back layer and on either side of the intermediate partition. Electronic integrated circuit (IC) chips are located inside the cavities and mounted on top of the solid back layer. Each IC chip includes an integrated optical element. Electrical connections are provided between the IC chips and back electrical contacts of the solid back layer. Transparent encapsulation blocks are molded in the cavities to embed the IC chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.