Remi Brechignac
26Patents
6h-index
23Co-inventors
69Inventor score
Filing activity: Jan 26, 1999 → Nov 6, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6893169B1 | Optical semiconductor package and process for fabricating the same | Electricity | 27 | Expired |
| US6870238B2 | Shielded housing for optical semiconductor component | Electricity | 11 | Expired |
| US7327005B2 | Optical semiconductor package with incorporated lens and shielding | Electricity | 10 | Expired |
| US6969898B1 | Optical semiconductor housing and method for making same | Electricity | 9 | Expired |
| US6374486B1 | Smart card and process for manufacturing the same | Emerging Cross-Sectional Technologies | 8 | Expired |
| US9136292B2 | Optical electronic package having a blind cavity for covering an optical sensor | Electricity | 8 | Active |
| US6312975A | Semiconductor package and method of manufacturing the same | Electricity | 5 | Expired |
| US6713876B1 | Optical semiconductor housing and method for making same | Electricity | 5 | Expired |
| US7061697B2 | Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding device | Electricity | 4 | Expired |
| US6174113A | Method and apparatus for machining a cavity in a smart card | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7012331B2 | Device for mounting a semiconductor package on a support plate via a base | Electricity | 3 | Expired |
| US6696006B2 | Mold for flashless injection molding to encapsulate an integrated circuit chip | Electricity | 1 | Expired |
| US9006904B2 | Dual side package on package | Electricity | 1 | Active |
| US11322666B2 | Optoelectronic device | Electricity | 1 | Active |
| US9076749B2 | Electronic system comprising stacked electronic devices comprising integrated-circuit chips | Electricity | 0 | Active |
| US11935992B2 | Electronic device comprising optical electronic components and fabricating process | Electricity | 0 | Active |
| US8482116B2 | Semiconductor device having stacked components | Electricity | 0 | Active |
| US9196590B2 | Perforated electronic package and method of fabrication | Electricity | 0 | Active |
| US6597020B1 | Process for packaging a chip with sensors and semiconductor package containing such a chip | Electricity | 0 | Expired |
| US11502227B2 | Electronic device comprising optical electronic components and fabricating process | Electricity | 0 | Active |
| US11862757B2 | Electronic package | Electricity | 0 | Active |
| US12218287B2 | Electronic package | Electricity | 0 | Active |
| US7326968B2 | Semiconductor packaging unit with sliding cage | Electricity | 0 | Active |
| US11908968B2 | Optoelectronic device | Electricity | 0 | Active |
| US11380663B2 | Electronic device comprising optical electronic components and manufacturing method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.