Patent · US Active

Antenna modules and communication devices

US11380979B2 · kind B2 · utility

7Cited by

8References

25Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Sidharth Dalmia · Portland, US
Jonathan Jensen · Portland, US
Ozgur Inac · Sunnyvale, US
Trang Thai · San Diego, US
William J. Lambert · Chandler, US
Benjamin Jann · Hillsboro, US

Key dates

Filing date	Mar 29, 2018
Grant date	Jul 5, 2022
Priority date	—
Expiry date	Sep 17, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01Q1/38
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.