Inventor · Chandler, AZ, US

William J. Lambert

60Patents
5h-index
92Co-inventors
75Inventor score

Filing activity: Aug 10, 1982 → Jan 22, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US4488224A System for controlling data flow Physics 16 Expired
US9515003B1 Embedded air core inductors for integrated circuit package substrates with thermal conductor Electricity 12 Active
US9230944B1 Techniques and configurations associated with a capductor assembly Electricity 10 Active
US11380979B2 Antenna modules and communication devices Electricity 7 Active
US10797394B2 Antenna modules and communication devices Electricity 5 Active
US8243410B2 Transient voltage compensation system and method Electricity 5 Active
US9911723B2 Magnetic small footprint inductor array module for on-package voltage regulator Electricity 3 Active
US10163557B2 Helical plated through-hole package inductor Electricity 3 Active
US11335620B2 Package inductor having thermal solution structures Electricity 3 Active
US9177831B2 Die assembly on thin dielectric sheet Electricity 2 Active
US9753510B2 Apparatus and method to reduce power losses in an integrated voltage regulator Electricity 2 Active
US10672693B2 Integrated circuit structures in package substrates Electricity 2 Active
US11355849B2 Antenna package using ball attach array to connect antenna and base substrates Electricity 2 Active
US11937367B2 Radio frequency front-end structures Electricity 1 Active
US10340260B2 Magnetic small footprint inductor array module for on-package voltage regulator Electricity 1 Active
US12132015B2 Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operations Electricity 1 Active
US11121468B2 Antenna modules and communication devices Electricity 1 Active
US10658765B2 Edge-firing antenna walls built into substrate Electricity 1 Active
US11664596B2 Antenna modules and communication devices Electricity 1 Active
US11112841B2 5G mmWave cooling through PCB Emerging Cross-Sectional Technologies 1 Active
US12288750B2 Conformal power delivery structure for direct chip attach architectures Electricity 1 Active
US9899311B2 Hybrid pitch package with ultra high density interconnect capability Electricity 1 Active
US9397071B2 High density interconnection of microelectronic devices Emerging Cross-Sectional Technologies 1 Active
US10998120B2 Method of making an inductor Electricity 1 Active
US11107757B2 Integrated circuit structures in package substrates Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.