Resin composition and article made therefrom
US11384239B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 29, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Mar 20, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure provides a resin composition which comprises: 90 parts by weight of vinyl-containing polyphenylene oxide resin; 35 to 70 parts by weight of chemically synthetic silica; and 10 to 30 parts by weight of spherical inorganic fillers, wherein the spherical inorganic fillers include spherical boron nitride, spherical hollow boron silicate or a combination thereof. The present disclosure also provides an article made from the resin composition, wherein the article includes a prepreg, a resin film, a laminate or a printed circuit board. The resin composition of the invention can make the article made therefrom achieve better peeling strength, dielectric constant, dissipation factor, no weave exposure produced and no stripes of branch-like pattern produced at the laminate edge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.