Dual additive composition for polishing memory hard disks exhibiting edge roll off
US11384253B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2019 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Dec 30, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/84
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive comprising colloidal silica, (b) a compound of formula (I), (c) a compound of formula (II), (d) hydrogen peroxide, and (e) water, wherein the polishing composition has a pH of about 1 to about 5. The invention also provides a method of chemically-mechanically polishing a substrate, especially a nickel-phosphorous substrate, by contacting the substrate with the inventive chemical-mechanical polishing composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.