Polishing slurry composition for STI process
US11384255B2 · kind B2 · utility
2Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2018 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Feb 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a nitride film polishing barrier inclusive of a polymer having an amide bond.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.