Method for manufacturing a mixed substrate
US11387100B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 10, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | Oct 8, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/762
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a mixed substrate having, on a main face of a support substrate, a first region and a second region, includes a) providing a starting substrate which comprises an intermediate layer, consisting of the second material, and the support substrate; b) forming a mask which comprises an aperture delimiting the first region; c) forming a cavity; and d) forming the first region by epitaxially growing the first material in a single crystal form in the cavity The method includes step c1), performed before step d), of forming a protective layer, made of an amorphous material, overlaying the flank of the cavity and leaving the bottom of said cavity exposed to the external environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.