Patent · US Active

Scalable debris-free socket loading mechanism

US11387163B2 · kind B2 · utility

0Cited by

30References

16Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Andrew Larson · Hillsboro, US
Bijoyraj Sahu · Portland, US
Craig Jahne · Beaverton, US
Eric W. Buddrius · Hillsboro, US
Ralph V. Miele · Hillsboro, US

Key dates

Filing date	Mar 30, 2018
Grant date	Jul 12, 2022
Priority date	—
Expiry date	Aug 4, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2023/4087
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.