Semiconductor device and manufacturing method thereof
US11387164B2 · kind B2 · utility
14Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 2020 |
| Grant date | Jul 12, 2022 |
| Priority date | — |
| Expiry date | May 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10158
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a package and a cooling cover. The package includes a first die having an active surface and a rear surface opposite to the active surface. The rear surface has a cooling region and a peripheral region enclosing the cooling region. The first die includes micro-trenches located in the cooling region of the rear surface. The cooling cover is stacked on the first die. The cooling cover includes a fluid inlet port and a fluid outlet port located over the cooling region and communicated with the micro-trenches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.