Patent · US Active

Embedded very high density (VHD) layer

US11387187B2 · kind B2 · utility

0Cited by

2References

25Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Andrew Collins · Chandler, US
Jianyong Xie · Chandler, US
Sujit Sharan · Boise, US
Henning Braunisch · Chandler, US
Aleksandar Aleksov · Chandler, US

Key dates

Filing date	Jun 28, 2018
Grant date	Jul 12, 2022
Priority date	—
Expiry date	Nov 12, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15192
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments may relate to an interposer that has a first layer with a plurality of first layer pads that may couple with a die. The interposer may further include a second layer with a power delivery component. The interposer may further include a very high density (VHD) layer, that has a VHD pad coupled by a first via with the power delivery component and coupled by a second via with a first layer pad. Other embodiments may be described and/or claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.