Patent · US Active

Power semiconductor module with press-fit contact element

US11387588B2 · kind B2 · utility

0Cited by

4References

17Claims

0Family size

Assignee

SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

Ingo Bogen · Nuremberg, DE
Alexander Wehner · Nuremberg, DE

Key dates

Filing date	Apr 14, 2021
Grant date	Jul 12, 2022
Priority date	—
Expiry date	Apr 14, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10871
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A power semiconductor module has a substrate, load and auxiliary connector elements, and a plastic body, which preferably is a housing or a housing frame and which has a channel. The channel being for the arrangement of a compensating portion of a press-fit contact element. The press-fit contact element has a press-fit portion, a compensating portion and a foot portion, the compensating portion being elastic in a longitudinal direction of the press-fit contact element and having at least two O-shaped sub-portions arranged in succession in the longitudinal direction and having a constriction arranged between two sub-portions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.