Alexander Wehner
10Patents
2h-index
17Co-inventors
43Inventor score
Filing activity: Feb 28, 2018 → May 7, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10090774B1 | Power electronic arrangement with DC voltage connection element | Electricity | 10 | Active |
| US10270358B2 | Power electronics submodule having DC and AC voltage terminal elements, and assembly hereof | Electricity | 3 | Active |
| US12199021B2 | Power semiconductor module and method for producing a power semiconductor module | Electricity | 0 | Active |
| US11533822B2 | Power electronics submodule for mounting on a cooling device | Electricity | 0 | Active |
| US11800644B2 | Power electronic switching device, power semiconductor module therewith and method for production | Electricity | 0 | Active |
| US12094797B2 | Pressing device for directly or indirectly applying pressure to power-semiconductor components of a power-semiconductor module | Electricity | 0 | Active |
| US12096577B1 | Power semiconductor arrangement having a cover facility and method for releasing it | Electricity | 0 | Active |
| US11387588B2 | Power semiconductor module with press-fit contact element | Electricity | 0 | Active |
| US12062601B2 | Power semiconductor module having a DC voltage connecting device | Electricity | 0 | Active |
| US10957560B2 | Pressure sintering procedure in which power semiconductor components with a substrate are connected to each other via a sintered connection | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.