Composite and multilayered silver films for joining electrical and mechanical components
US11390054B2 · kind B2 · utility
0Cited by
9References
19Claims
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Key dates
| Filing date | Jul 13, 2020 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Jul 13, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12139
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.