Temperature control assembly for substrate processing apparatus and method of using same
US11390945B2 · kind B2 · utility
3Cited by
2,211References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2020 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Jun 30, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Exemplary embodiments of the disclosure provide improved reactor systems, assemblies, and methods for controlling a temperature within the reactor system, such as a temperature of a gas supply unit. Exemplary systems and methods employ an exhaust unit to cause movement of a fluid over a portion of the gas supply unit to better control the temperature of the gas supply unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.