Gap filling composition and pattern forming method using composition containing polymer
US11392035B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | May 29, 2017 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Jul 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31116
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
[Subject] There is provided a gap filling composition which can reduce pattern collapse and a pattern forming method using the composition. [Solution means] There is provided a gap filling composition including a polymer having a certain structure and an organic solvent. There is provided a pattern forming method using a certain polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.