Copper-alloy capping layers for metallization in touch-panel displays
US11392257B2 · kind B2 · utility
1Cited by
3References
21Claims
0Family size
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Key dates
| Filing date | Jan 8, 2021 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Jan 8, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12931
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.