Mask design for improved attach position
US11393698B2 · kind B2 · utility
2Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2020 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Dec 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a semiconductor package including a substrate with a land grid array. A component is disposed over the substrate. An encapsulant is deposited over the component. The land grid array remains outside the encapsulant. A metal mask having a fiducial marker is disposed over the land grid array. A shielding layer is formed over the semiconductor package. The metal mask is removed after forming the shielding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.