Patent assignee · SG · COMPANY

STATS ChipPAC Pte. Ltd.

392Patents
392Active
392Granted
62Portfolio score

Filing activity: Dec 3, 2007 → Apr 15, 2024 · 2 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US9385006B2 Semiconductor device and method of forming an embedded SOP fan-out package Electricity 62 Active
US9443797B2 Semiconductor device having wire studs as vertical interconnect in FO-WLP Electricity 53 Active
US9679863B2 Semiconductor device and method of forming interconnect substrate for FO-WLCSP Electricity 52 Active
US9735113B2 Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP Electricity 48 Active
US9385009B2 Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP Electricity 46 Active
US9508626B2 Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height Electricity 46 Active
US9397050B2 Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant Electricity 45 Active
US9524955B2 Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure Electricity 44 Active
US9406619B2 Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die Electricity 42 Active
US9496152B2 Carrier system with multi-tier conductive posts and method of manufacture thereof Emerging Cross-Sectional Technologies 41 Active
US9893045B2 Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect Electricity 30 Active
US9842798B2 Semiconductor device and method of forming a PoP device with embedded vertical interconnect units Electricity 28 Active
US9837484B2 Semiconductor device and method of forming substrate including embedded component with symmetrical structure Electricity 27 Active
US9786623B2 Semiconductor device and method of forming PoP semiconductor device with RDL over top package Electricity 22 Active
US9527723B2 Semiconductor device and method of forming microelectromechanical systems (MEMS) package Electricity 20 Active
US9391046B2 Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer Electricity 18 Active
US9941207B2 Semiconductor device and method of fabricating 3D package with short cycle time and high yield Electricity 17 Active
US10049964B2 Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Electricity 16 Active
US9368563B2 Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer Electricity 15 Active
US9806040B2 Antenna in embedded wafer-level ball-grid array package Electricity 14 Active
US10453785B2 Semiconductor device and method of forming double-sided fan-out wafer level package Electricity 13 Active
US9685350B2 Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB Electricity 13 Active
US9548240B2 Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package Electricity 12 Active
US9875911B2 Semiconductor device and method of forming interposer with opening to contain semiconductor die Electricity 12 Active
US9837303B2 Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units Electricity 12 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.