Package-integrated multi-turn coil embedded in a package magnetic core

US11393751B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Huong Do · Scottsdale, US
• Kaladhar Radhakrishnan · Chandler, US
• Krishna Bharath · Phoenix, US
• Yikang Deng · New York, US
• Amruthavalli Pallavi Alur · Tempe, US

Key dates

• Filing date: Aug 21, 2018
• Grant date: Jul 19, 2022
• Expiry date: Nov 9, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/16225
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A microelectronics package comprising a substrate, the substrate comprising a dielectric and at least first and second conductor level within the dielectric, where the first and second conductor levels are separated by at least one dielectric layer. The microelectronics package comprises an inductor structure that comprises a magnetic core. The magnetic core is at least partially embedded within the dielectric. The inductor structure comprises a first trace in the first conductor level, a second trace in the second conductor level, and a via interconnect connecting the first and second traces. The first trace and the second trace extend at least partially within the magnetic core.