Inventor · Scottsdale, AZ, US

Huong Do

16Patents
7h-index
21Co-inventors
66Inventor score

Filing activity: Jun 11, 1999 → Jun 13, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US6446317B1 Hybrid capacitor and method of fabrication therefor Emerging Cross-Sectional Technologies 110 Expired
US6366467B1 Dual-socket interposer and method of fabrication therefor Electricity 59 Expired
US6532143B2 Multiple tier array capacitor Electricity 55 Expired
US6920051B2 Hybrid capacitor, circuit, and system Emerging Cross-Sectional Technologies 26 Expired
US6469908B2 Dual-socket interposer and method of fabrication therefor Electricity 21 Expired
US6483692B2 Capacitor with extended surface lands and method of fabrication therefor Electricity 18 Expired
US6303871A Degassing hole design for olga trace impedance Emerging Cross-Sectional Technologies 15 Expired
US11335620B2 Package inductor having thermal solution structures Electricity 3 Active
US11357096B2 Package substrate inductor having thermal interconnect structures Emerging Cross-Sectional Technologies 1 Active
US11404364B2 Multi-layer embedded magnetic inductor coil Electricity 0 Active
US11955426B2 Package-integrated multi-turn coil embedded in a package magnetic core Electricity 0 Active
US11690165B2 Package substrate inductor having thermal interconnect structures Emerging Cross-Sectional Technologies 0 Active
US12336196B2 Magnetic core inductors on package substrates Electricity 0 Active
US12154710B2 Package embedded magnetic power transformers for SMPS Electricity 0 Active
US11676950B2 Via-in-via structure for high density package integrated inductor Electricity 0 Active
US11393751B2 Package-integrated multi-turn coil embedded in a package magnetic core Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.