Alignment carrier for interconnect bridge assembly
US11393759B2 · kind B2 · utility
0Cited by
8References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2019 |
| Grant date | Jul 19, 2022 |
| Priority date | — |
| Expiry date | Mar 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/95146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An alignment carrier, assembly and methods that enable the precise alignment and assembly of two or more semiconductor die using an interconnect bridge. The alignment carrier includes a substrate composed of a material that has a coefficient of thermal expansion that substantially matches that of an interconnect bridge. The alignment carrier further includes a plurality of solder balls located on the substrate and configured for alignment of two or more semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.