Inventor · Fishkill, NY, US

Bhupender Singh

16Patents
1h-index
31Co-inventors
46Inventor score

Filing activity: Mar 7, 2018 → Oct 12, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US11031373B2 Spacer for die-to-die communication in an integrated circuit Electricity 1 Active
US11282773B2 Enlarged conductive pad structures for enhanced chip bond assembly yield Electricity 1 Active
US11201136B2 High bandwidth module Emerging Cross-Sectional Technologies 0 Active
US11756930B2 High bandwidth module Emerging Cross-Sectional Technologies 0 Active
US11393759B2 Alignment carrier for interconnect bridge assembly Electricity 0 Active
US11694992B2 Near tier decoupling capacitors Electricity 0 Active
US11004614B2 Stacked capacitors for use in integrated circuit modules and the like Electricity 0 Active
US11195576B2 Robust adaptive method and circuit for controlling a timing window for enabling operation of sense amplifier Physics 0 Active
US11211262B2 Electronic apparatus having inter-chip stiffener Electricity 0 Active
US12170120B2 Built-in self test circuit for segmented static random access memory (SRAM) array input/output Physics 0 Active
US11410894B2 Polygon integrated circuit (IC) packaging Electricity 0 Active
US11521952B2 Spacer for die-to-die communication in an integrated circuit and method for fabricating the same Electricity 0 Active
US11031343B2 Fins for enhanced die communication Electricity 0 Active
US11404365B2 Direct attachment of capacitors to flip chip dies Electricity 0 Active
US12353341B2 Tuning of read/write cycle time delay for a memory circuit dependent on operational mode selection Physics 0 Active
US10626074B2 Process for preparation of halo substituted benzoic acid compound and intermediates thereof Chemistry; Metallurgy 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.