Patent · US Active

Floating-bridge interconnects and methods of assembling same

US11393760B2 · kind B2 · utility

0Cited by

7References

19Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Boon Ping Koh · Permatang Janggus, MY
Eng Huat Goh · Air Itam, MY
Jiun Hann Sir · Air Itam, MY
Khang Choong Yong · Puchong, MY
Min Suet Lim · Kampung Bukit Kechil, MY
Wil Choon Song · Bayan Lepas, MY

Key dates

Filing date	Sep 15, 2020
Grant date	Jul 19, 2022
Priority date	—
Expiry date	Sep 15, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18162
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor apparatus includes a floating-bridge interconnect that couples two semiconductive devices that are arranged across a middle semiconductive device. The floating-bridge interconnect can be semiconductive material such as a silicon bridge, or it can be an organic bridge. Computing functions required in one of the two semiconductive devices can be off-loaded to any of the floating-bridge interconnect or the other of the two semiconductive devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.