Patent · US Active

Integrated circuit package with glass spacer

US11393788B2 · kind B2 · utility

0Cited by

2References

12Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Mao Guo · Shanghai, CN
Hyoung Il Kim · Folsom, US
Yong She · Shanghai, CN
Sireesha Gogineni · Folsom, US

Key dates

Filing date	Sep 22, 2016
Grant date	Jul 19, 2022
Priority date	—
Expiry date	Apr 22, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Apparatuses, systems and methods associated with integrated circuit (IC) package design are disclosed herein. In embodiments, an IC package may include a first die and a second die. The IC package may include a spacer located between the first die and the second die, the spacer includes glass, and a molding compound that at least partially encompasses the first die, the second die, and the spacer. Other embodiments may be described and/or claimed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.