Inventor · Shanghai, CN

Yong She

23Patents
3h-index
26Co-inventors
55Inventor score

Filing activity: Nov 12, 2014 → Apr 18, 2022

Most-cited inventions

PatentTitleAreaCited byStatus
US9778688B2 Flexible system-in-package solutions for wearable devices Electricity 5 Active
US10910347B2 Method, apparatus and system to interconnect packaged integrated circuit dies Electricity 5 Active
US9859255B1 Electronic device package Electricity 3 Active
US10770434B2 Stair-stacked dice device in a system in package, and methods of making same Electricity 2 Active
US10332899B2 3D package having edge-aligned die stack with direct inter-die wire connections Electricity 2 Active
US10396055B2 Method, apparatus and system to interconnect packaged integrated circuit dies Electricity 2 Active
US10727208B2 Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same Electricity 1 Active
US10438916B2 Wire bond connection with intermediate contact structure Electricity 1 Active
US11081451B2 Die stack with reduced warpage Electricity 1 Active
US11538746B2 Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same Electricity 0 Active
US11830848B2 Electronic device package Electricity 0 Active
US10991679B2 Stair-stacked dice device in a system in package, and methods of making same Electricity 0 Active
US12046581B2 Integrated circuit package with glass spacer Electricity 0 Active
US11990395B2 Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement Electricity 0 Active
US12027496B2 Film in substrate for releasing z stack-up constraint Electricity 0 Active
US11302671B2 Power enhanced stacked chip scale package solution with integrated die attach film Electricity 0 Active
US11848281B2 Die stack with reduced warpage Electricity 0 Active
US11742284B2 Interconnect structure fabricated using lithographic and deposition processes Electricity 0 Active
US11881441B2 Stacked die semiconductor package spacer die Electricity 0 Active
US11393788B2 Integrated circuit package with glass spacer Electricity 0 Active
US10930622B2 Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same Electricity 0 Active
US11894344B2 Power enhanced stacked chip scale package solution with integrated die attach film Electricity 0 Active
US10872832B2 Pre-molded active IC of passive components to miniaturize system in package Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.