Semiconductor package device
US11399429B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2020 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | May 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1438
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first interconnection layer is within the first dielectric layer. The second interconnection layer is on the second surface of the first dielectric layer and extends from the second surface of the first dielectric layer into the first dielectric layer to electrically connect to the first interconnection layer. The second dielectric layer covers the second surface and the lateral surface of the first dielectric layer and the second interconnection layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.