Power module, chip-embedded package module and manufacturing method of chip-embedded package module
US11399438B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2019 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | Aug 28, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a power module, a chip-embedded package module and a manufacturing method of the chip-embedded package module. The chip-embedded package module includes: a chip having a first surface and a second surface that are disposed oppositely; a first plastic member including a first cover portion and a first protrusion; and a second plastic member including a second cover portion and a second protrusion. A height difference discontinuous interface structure is formed between the top surface of the second protrusion and the second surface of the chip, which cuts off a passage for expansion of delamination at an edge position of the chip, thereby effectively suppressing generation of the delamination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.