Method for manufacturing coreless substrate
US11399440B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Jul 26, 2022 |
| Priority date | — |
| Expiry date | Sep 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0152
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the first Cu foil layer and the second Cu foil layer may include double Cu foils which are physically attached together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.