Inventor · Zhuhai, CN

Benxia HUANG

32Patents
0h-index
22Co-inventors
43Inventor score

Filing activity: May 12, 2020 → Jan 15, 2025

Most-cited inventions

PatentTitleAreaCited byStatus
US11342273B2 Package structure of integrated passive device and manufacturing method thereof, and substrate Electricity 0 Active
US12300576B2 Cyclic cooling embedded packaging substrate and manufacturing method thereof Electricity 0 Active
US11579362B2 Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof Physics 0 Active
US12300511B1 Fabrication method for package structure Electricity 0 Active
US12002734B2 Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof Electricity 0 Active
US11503712B2 Passive device packaging structure embedded in glass medium and method for manufacturing the same Electricity 0 Active
US11257713B2 Interposer board without feature layer structure and method for manufacturing the same Electricity 0 Active
US11682621B2 Connector for implementing multi-faceted interconnection Electricity 0 Active
US12040272B2 Connector for implementing multi-faceted interconnection Electricity 0 Active
US12302508B2 Temporary carrier and method for manufacturing coreless substrate thereby Electricity 0 Active
US11450619B2 Embedded packaging structure having shielding cavity and manufacturing method thereof Electricity 0 Active
US11399440B2 Method for manufacturing coreless substrate Electricity 0 Active
US12418988B2 Inductor-integrating embedded support frame and substrate, and manufacturing method thereof Electricity 0 Active
US11569177B2 Support frame structure and manufacturing method thereof Electricity 0 Active
US12278227B2 Hybrid embedded packaging structure and manufacturing method thereof Electricity 0 Active
US11114310B1 Embedded packaging method capable of realizing heat dissipation Electricity 0 Active
US12074115B2 Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate Electricity 0 Active
US11515258B2 Package substrate and manufacturing method thereof Electricity 0 Active
US11942465B2 Embedded structure, manufacturing method thereof and substrate Electricity 0 Active
US12148676B2 Embedded chip package and manufacturing method thereof Electricity 0 Active
US12402414B2 Capacitor and inductor embedded structure and manufacturing method therefor, and substrate Electricity 0 Active
US12412843B2 Support frame structure and manufacturing method thereof Electricity 0 Active
US12400967B2 Embedded packaging structure and manufacturing method thereof Electricity 0 Active
US11961743B2 Substrate manufacturing method for realizing three-dimensional packaging Electricity 0 Active
US11984414B2 Packaging structure with antenna and manufacturing method thereof Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.