Sintering tool and method for sintering an electronic subassembly

US11400514B2 · kind B2 · utility

Assignee

• DANFOSS SILICON POWER GMBH · DE

Inventors

• Frank Osterwald · Kiel, DE
• Martin Becker · Kiel, DE
• Lars Paulsen · Hollingstedt, DE
• Jacek Rudzki · Kiel, DE
• Holger Ulrich · Nortorf, DE
• Ronald Eisele · Surendorf, DE

Key dates

• Filing date: Oct 1, 2020
• Grant date: Aug 2, 2022
• Expiry date: Jan 11, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/00014
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

Sintering tool (10) with a cradle for receiving an electronic subassembly (BG) to be sintered, characterized by at least one support bracket (20), arranged at two locations opposite the cradle, for fixing a protective film (30) covering the electronic subassembly (BG).